CAPABILITIES
PCB Fabrication Capabilities & Specifications
Magic Electronic PCB fabrication capabilities cover the full spectrum from simple single-layer boards to advanced 40-layer HDI designs. Below is our complete PCB capability sheet for 2026.
Layer Count & Board Types
Board Type | Layer Range | Min Trace/Space | Min Drill |
Single-Sided PCB | 1 | 6/6 mil | 0.3 mm |
Double-Sided PCB | 2 | 4/4 mil | 0.2 mm |
Multilayer PCB | 4–40 | 3/3 mil | 0.15 mm |
HDI PCB | 4–20 | 2.5/2.5 mil | 0.075 mm (laser) |
Rigid-Flex PCB | 2–20 | 3/3 mil | 0.15 mm |
Heavy Copper PCB | 1–8 | 8/8 mil | 0.3 mm |
Aluminum/MCPCB | 1–4 | 6/6 mil | 0.3 mm |
Material Options
We support all major PCB substrates:
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FR4 materials come in different varieties – standard, mid-Tg, and high-Tg, such as Shengyi S1141 and Kingboard KB-6160.
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For high-frequency applications, Rogers 4003C and 4350B are options, along with Taconic and Isola materials.
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Metal core printed circuit boards are made with aluminum or copper, often used for LED and power applications.
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Flexible substrates include polyimide, or PI, and PET.
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Special materials are also available, like PTFE and ceramic-filled hydrocarbon.
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Special Process Capabilities
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Impedance Control – ±5% tolerance (single-ended and differential)
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HDI – up to 3+N+3 stacked microvias
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Heavy Copper – up to 12 oz outer and 6 oz inner
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Castellated Holes – for module integration
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Edge Plating – for shielding and connectors
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Buried and Blind Vias – mechanical and laser drilled
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Via-in-Pad with Resin Fill – which is the standard for fine-pitch BGA.
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Surface Finish & Solder Mask Options
Surface Finish | RoHS | Shelf Life | Best For |
HASL (Lead-Free) | Yes | 12 months | Cost-sensitive designs |
ENIG | Yes | 12+ months | Fine-pitch BGA, gold wire bonding |
OSP | Yes | 6 months | Single-reflow, lead-free assembly |
Immersion Silver | Yes | 6–12 months | High-frequency RF |
Immersion Tin | Yes | 6 months | Press-fit connectors |
Hard Gold | Yes | 24+ months | Edge connectors, contacts |
Solder mask colors available: Green, Black, White, Blue, Red, Yellow, Purple, Matte Black.
Complete PCB Capability Comparison Table
Specification | Magic Electronic Capability |
Max Layer Count | 40 layers |
Min Trace Width | 2.5 mil (0.0635 mm) |
Min Drill Diameter | 0.075 mm (laser) / 0.15 mm (mechanical) |
Max Board Size | 610 × 1100 mm |
Min Board Thickness | 0.2 mm |
Max Board Thickness | 6.0 mm |
Max Copper Weight | 12 oz (outer) |
Aspect Ratio | 12:1 (mechanical) / 1:1 (laser) |
Impedance Tolerance | ±5% |
Quality Standard | IPC-A-600 Class 2 / Class 3 |
