CAPABILITIES

PCB Fabrication Capabilities & Specifications

Magic Electronic PCB fabrication capabilities cover the full spectrum from simple single-layer boards to advanced 40-layer HDI designs. Below is our complete PCB capability sheet for 2026.

Layer Count & Board Types

Board Type

Layer Range

Min Trace/Space

Min Drill

Single-Sided PCB

1

6/6 mil

0.3 mm

Double-Sided PCB

2

4/4 mil

0.2 mm

Multilayer PCB

4–40

3/3 mil

0.15 mm

HDI PCB

4–20

2.5/2.5 mil

0.075 mm (laser)

Rigid-Flex PCB

2–20

3/3 mil

0.15 mm

Heavy Copper PCB

1–8

8/8 mil

0.3 mm

Aluminum/MCPCB

1–4

6/6 mil

0.3 mm


Material Options


We support all major PCB substrates:

· 

FR4 materials come in different varieties – standard, mid-Tg, and high-Tg, such as Shengyi S1141 and Kingboard KB-6160.

· 

· 

For high-frequency applications, Rogers 4003C and 4350B are options, along with Taconic and Isola materials.

· 

· 

Metal core printed circuit boards are made with aluminum or copper, often used for LED and power applications.

· 

· 

Flexible substrates include polyimide, or PI, and PET.

· 

· 

Special materials are also available, like PTFE and ceramic-filled hydrocarbon.

· 

Special Process Capabilities

· 

Impedance Control – ±5% tolerance (single-ended and differential)

· 

· 

HDI – up to 3+N+3 stacked microvias

· 

· 

Heavy Copper – up to 12 oz outer and 6 oz inner

· 

· 

Castellated Holes – for module integration

· 

· 

Edge Plating – for shielding and connectors

· 

· 

Buried and Blind Vias – mechanical and laser drilled

· 

· 

Via-in-Pad with Resin Fill – which is the standard for fine-pitch BGA.

· 

Surface Finish & Solder Mask Options

Surface Finish

RoHS

Shelf Life

Best For

HASL (Lead-Free)

Yes

12 months

Cost-sensitive designs

ENIG

Yes

12+ months

Fine-pitch BGA, gold wire bonding

OSP

Yes

6 months

Single-reflow, lead-free assembly

Immersion Silver

Yes

6–12 months

High-frequency RF

Immersion Tin

Yes

6 months

Press-fit connectors

Hard Gold

Yes

24+ months

Edge connectors, contacts

Solder mask colors available: Green, Black, White, Blue, Red, Yellow, Purple, Matte Black.


Complete PCB Capability Comparison Table

Specification

Magic Electronic Capability

Max Layer Count

40 layers

Min Trace Width

2.5 mil (0.0635 mm)

Min Drill Diameter

0.075 mm (laser) / 0.15 mm (mechanical)

Max Board Size

610 × 1100 mm

Min Board Thickness

0.2 mm

Max Board Thickness

6.0 mm

Max Copper Weight

12 oz (outer)

Aspect Ratio

12:1 (mechanical) / 1:1 (laser)

Impedance Tolerance

±5%

Quality Standard

IPC-A-600 Class 2 / Class 3