PCB Raw Materials
PCB Laminate Material and Its Manufacturers
PCB Laminate Technical informations
About Printed Circuit Boards Materials Classification
1. PCB Material
Currently, the commonly double-sided PCB material is FR-4 and CEM-3 substrate. Both materials are flame retardant (UV 94-V0). FR4 material is a copper-clad laminate made of electronic grade alkali-free glass fiber cloth impregnated with flame-retardant brominated epoxy resin, copper foil on one or both sides, and hot pressing.
The CEM-3 type material is an electronic grade alkali-free glass non-aromatic cloth with flame-retardant brominated epoxy resin filled in the middle insulation layer, and one sheet is filled with flame-retardant brominated epoxy resin on both sides of the non-woven fabric. Copper foil is on one or both sides of Resin electronic-grade alkali-free glass fiber cloth and is then formed by hot-pressing into copper-clad laminate.
2. PCB Material Types
FR-1: phenolic paper substrate, breakdown voltage 787V/mm surface resistance, volume resistance lower than FR2
FR-2: phenolic paper substrate, breakdown voltage 1300V/mm
FR-3: epoxy paper substrate
FR-4: epoxy glass fiber board
CEM-1: epoxy glass cloth-paper composite board
CEM-3: epoxy glass cloth/glass mat board
HDI board: High-density interconnect
Copper-clad laminate is also called substrate. The reinforcing material is soaked with resin, one or both sides are covered with copper foil, and a board material is formed by hot pressing, which is called copper-clad laminate. This is the basic material of PCB, often called substrate. When it is used in multilayer PCB board production, it is also called “core.”
FR-2: Phenolic cotton paper
FR-3: Cotton paper, epoxy resin
FR-4: glass fiber cloth, epoxy resin
FR-5: glass fiber cloth, epoxy resin
FR-6: matte glass, polyester
G-10: glass fiber cloth, epoxy resin
CEM-1: cotton paper, epoxy resin (flame retardant)
CEM-3: cotton paper, epoxy resin (non-flame retardant)
CEM-4: glass cloth, epoxy resin
CEM-5: glass cloth, polyester
AIN: aluminum nitride
SIC: silicon carbide
At present, the copper-clad laminates supplied on the market can be divided into the following categories in terms of base material:
Paper substrate
Glass fiber cloth substrate
Synthetic fiber cloth substrate
Non-woven substrate
Composite substrate
Other
Copper-clad laminate refers to substrates such as paper and fiberglass cloth, which are filled with resin to make bonding sheets (adhesive paper and tape). After combining several bonding sheets, one or both sides are equipped with copper foil. It is cured by heat and pressure to make a plate-shaped product.
Shielding board material refers to a copper-clad laminate with a shielding layer or patterned circuit in the inner layer. As long as the circuit on both sides is processed, it can become a multilayer circuit board. This is also called a “copper clad laminate with shielding layer.”
Multilayer materials refer to copper-clad laminates and adhesive sheets (adhesive cloth) used to make multilayer circuit boards. Recently, this has come to include grease-coated copper foil (RCC) for multi-layer laminates. The so-called multi-layer board refers to a circuit board with two layers of patterned circuits on both surfaces and the inside.
Special substrates refer to laminates, metal core substrates, etc. used in the additive process, which are not included in the above-mentioned types of special plates.
Metal core substrates also include resin-coated substrates (FBC, etc.) Others are:
Aluminum core base substrates
Copper core base substrate
Ceramic core base substrate
Glass base substrate
Basic Knowledge of PCB Materials:
Copper-clad laminate, also called PCB substrate.
(1) A plate-shaped material formed by filling a reinforcing material (glass fiber cloth, referred to as glass fiber cloth) with resin (pp sheet), covering one or both sides with copper foil, and hot pressing, called a copper-clad layer pressure plate (Copper Clad Laminates, [CCL]).
(2) The basic material for PCB, it is often called board.
(3) When it is used in the production of multilayer boards, it is also called core board (or core).
Copper foil
(1) The thickness of copper foil is measured in oz (ounces), and oz itself is the unit of mass. Usually, the thickness of copper foil is expressed as “thickness” by mass. The thickness of copper foil is usually defined as “oz”, 1oz copper thickness—spread one ounce of copper evenly on one square foot area. At this time, the thickness of the copper foil is called 1oz copper thickness, and its thickness is exactly 1.37mil (about 1.4mil).